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Oklahoma State University

Wang, Shuodao

Assistant Professor

Mechanical and Aerospace Engineering
Oklahoma State University
218 Engineering North
Stillwater, Oklahoma 74078-5016 USA
Phone: (405) 744-5904

Group website:

Dr. Wang's CV

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Areas of Interest

  • Mechanics and Process Optimization of Transfer Printing Techniques for Micro-electronic Systems
  • Mechanical Actuators and Sensors
  • Bio-inspired and Bio-integrated Electronics
  • Theoretical and Experimental Solid Mechanics

Academic Background

2012  Ph.D., Mechanical Engineering, Northwestern University, Evanston, IL

2007  B.Eng., Engineering Mechanics, Tsinghua University, Beijing, China

Positions Available

Graduate and undergraduate applications are welcome for research positions on projects related to mechanics, design and fabrication of MEMS.  A variety of experimental and design projects are possible, including theoretical and numerical mechanics modeling, fabrication of micro-electronics, and bio-inspired / bio-integrated electronics systems.  Most projects are multidisciplinary in nature and will provide students the opportunity to work in advanced research facilities such as the cleanroom and imaging suite at the Helmerich Research Center.

If you are interested, please contact Prof. Shuodao Wang ( Please include your detailed curriculum vitae along with a brief cover letter expressing your research interests and your academic background.


Jan 2016 – our work on “Adhesion-governed buckling of thin-film electronics on soft tissues” is published on Theoretical and Applied Mechanics Letters.

Nov 2015 – Dr. Wang was awarded the “ASME Applied Mechanics Division - Haythornthwaite Foundation Research Initiation Grant".

Sep 2015 – Dr. Wang wrote invited review article for IEEE Transactions on Components, Packaging and Manufacturing Technology.

Mar 2015 – Dr. Bo Wang from Northwestern Polytechnical University, Xi’an China joined our group as a postdoc.

Select Publications

B. Wang and S. Wang, “Adhesion-Governed Buckling of Thin-Film Electronics on Soft Tissues,” Theor. Appl. Mech. Lett. 6:1 | DOI:10.1016/j.taml.2015.11.010 (2016)

S. Wang, Y. Huang and J. A. Rogers, “Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics,” IEEE Trans. Compon. Packag. Manuf. Technol. 5:9 (2015)

Y. Zhang†, S. Wang†, X. Li, J. A. Fan, S. Xu, Y. M. Song, K.-J. Choi, W.-H. Yeo, W. Lee, S. N. Nazaar, B. Lu, L. Yin, K.-C. Hwang, J. A. Rogers, and Y. Huang, “Experimental and Theoretical Studies of Serpentine Microstructures Bonded to Prestrained Elastomers for Stretchable Electronics,” Advanced Functional Materials 24:14, 2028–2037 (2014)

D.-H. Kim†, R. Ghaffari†, N. Lu†, S. Wang†, S. P. Leeb, H. Keume, R. D’Angelo, L. Klinker, Y. Su, C. Lu, Y.-S. Kim, A. Ameen, Y. Li, Y. Zhang, B. de Graff, Y.-Y. Hsu, Z. Liu, J. Ruskin, L. Xu, C. Lu, F. G. Omenetto, Y. Huang, M. Mansour, M. J. Slepian, and J. A. Rogers, “Electronic Sensor and Actuator Webs for Large-Area Cardiac Mapping and Therapy,” Proceedings of the National Academy of Sciences USA, 109:49 19910-19915 (2012)

A. Carlson†, S. Wang†, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, Programmable Elastomeric Surfaces with Tunable Adhesion for Deterministic Assembly by Transfer Printing,” Advanced Functional Materials 22, 4476-4484 (2012)

S. Wang, M. Li, J. Wu, D.-H. Kim, N. Lu, Y. Su, Z. Kang, Y.Huang, and J. A. Rogers, “Mechanics of Epidermal Electronics,” Journal of Applied Mechanics 79:3, article 031022 (2012)

S. Wang, J. Xiao, J. Song, H. C. Ko, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of Curvilinear Electronics,” Soft Matter 6, 5757–5763 (2010)

S. Wang, J. Xiao, I. Jung, J. Song, H. C. Ko, M. P. Stoykovich, Y. Huang, K.-C. Hwang, and J. A. Rogers, “Mechanics of Hemispherical Electronics,” Applied Physics Letters, Letter 95, article 181912 (APL’s 50th Anniversary Editor’s Picks, 2009)

S. Wang, J. Song, D. H. Kim, Y. Huang, and J. A. Rogers, “Local Versus Global Buckling of Thin Films on Elastomeric Substrates,” Applied Physics Letters, Letter 93, article 023126 (2008)